X-bit labs - Hardware news - AMD Heading Towards Land-Grid Array Sockets – Report.
However, it seems that AMD decided to use LGA casing for the future chips, as LGA typically provides both a high density range and interface wipe for a reliable, long-term electrical connection from the microprocessor to the printed circuit board, according to sockets manufacturer Tyco Electronics. Thanks to more reliable contact, CPU maker may increase the processor bus speed and memory speed, something which AMD officially wanted to do with the Opteron in future.
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