NEWS! - CCD failures: the bigger picture

NEWS! - CCD failures: the bigger picture: "The root cause of the problem is only hinted at by the advisories, but in our investigation of the problem we've uncovered more specific information. Semiconductor chips can be assembled into a variety of different package types and styles. Most chips these days are delivered in plastic (epoxy, actually) packages that are inexpensive, but that may not offer environmental protection as good as that of more expensive ceramic package types. Apparently, the generation of Sony sensors affected by the problem were packaged in plastic, and the design or manufacturing parameters for the packages involved resulted in their being susceptible to elevated moisture and humidity levels in typical digital camera usage. Only in very unusual circumstances (high heat, very high humidity, high pressure) does this quickly lead to a problem. In most cases, it takes a very long time for moisture to creep into a plastic chip package. Hence, only now, two or more years after the earliest of the cameras affected by this were manufactured, are we starting to see a widespread pattern of problems."